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Semiconductor Front End Fabrication Equipment Parts Service 

Etching, CVD, PVD, Ion Implanters and CMP Process
Brands include Applied Materials, Lam, TEL, Tegal, ASM, Novellus, PSC, Hitachi, Matrix, Varian, etc.
From 3" to 12" wafer fabrication equipment consumable parts
Materials include: Quartz, Ceramic, Aluminum, Sapphire, Stainless Steel, Elastomers, and all serials of
Engineering Plastic, Vespel, Lexan, PEEK, PPS, PEI, PSDU, PTFE, KEL-F, etc.

Semiconductor Fabrication Equipment – Spin Rinse Dryer, Vertical and Horizontal type, up to 8" substrates
Slurry: Local and Central Supply systems for the CMP Process

P5000 CVD Shower Heads and Susceptors – EESI can provide Shower Plates (Perf Plate) and Block Plates for AMAT 6" and 8" CVD Chambers. Also, 6" and 8" new and refurbished susceptors for TESO, NITRIDE, and Tungsten CVD are available.

TEL 85 DP Cooling Plate – 6" and 8" Cooling Plate for TEL 85 and 5000 Oxide Etcher. EESI provides different versions to match with Silicon or Glassy Carbon Electrode. EESI also provides repair services for the cooling plate by polishing and re-anodizing the surface to remove plasma and arcing damage. The anodization technology and comprehensive QA procedure guarantee equal or superior quality to the OEM part.

MIRRA CMP Rings & Seals – EESI provides specialized Engineering in plastic and elastomer components fabrication. These specially developed technologies have been successfully applied to manufacturing Semiconductor CMP rings and seals for Applied Materials’ Mirra CMP system. Knowledge in materials like PPS, PC, PTFE, PEEK, and POM special bonding process have helped to iprove the lifetime of the OEM parts.

EBARA CMP Rings – Plastic and ceramic components have been successfully applied to manufacturing Guide Rings and Ceramic Top Rings for the EBARA’s EPO CMP system. These components have helped extend the life of the OEM parts associated with them.

Applied P5000 Clamp Rings – The Clamp Ring and Pedestal Ceramic Ring are major consuambles. Modification of the Clamp Ring based on requirements has fulfilled the knowledge in Metal Etch. This knowledge has been applied on the clamp ring to reduce polymer peeling, wafer shifting and helium leaking, therefore increasing yield. All this while exceeding the quality of the OEM with low cost of ownership guaranteed.

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Hitachi Ground Electrode – CNC machining and anodization has been proven on the manufacturing and refurbishing of the Ground Electrode Etcher for Hitachi. The anodization spec for breakdown on the anodize film exceeds the OEM requirement. This part can also be refurbished by EESI to help reduce customer cost of ownership. Please contact us for more information on specs and services.

Chamber Refurbishing – The chambers’ anodized coating will always be eaten away by plasma and continuous brush cleaning. Ignoring the exposure of Aluminum will increase the device defect by metal and particle contamination. Our Anodization and precision masking technology has successfully been applied to the refirbishment of chambers and chamber lids for Applied’s P5000 and DPS systems. With low cost the customer can sustain their yield beyond the chamber’s current lifetime.

Tegal 903E Upper & Lower Electrode – EESI will refurbish whatever is still usable. Those anodized parts used in process chambers that used to be thrown away after the nodized coating peeled off, now can be refurbished and act like a new part while only losing nominal accuracy in dimensional tolerance. This service will save a lot of running cost for the customer. New precision parts are also available.

Applied MXP Oxide Etcher Chamber Liners Refurbished – Anodizing and precision masking technology has been successfully applied on the refurbishing of chamber liners. Our spec on breakdown, coating thickness and roughness meet or exceed the OEM’s. A detailed report will be attached for each refurbished part. No charge will be applied on parts that are not repairable. A report with a photo will be sent with the part.

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P5000, 5200 Chamber Liners – Though Chamber Liners are not a standard part of AMAT’s etching system, many customers have adapted our originally designed Chamber Liners in metal and WEB etchers to enhance polymer adaptation, prolong chamber life and reduce PM effots, thereby increasing production yield. Currently different versions have been developed to fit into different AMAT metal and WEB etcher chambers.

Kapton Tape –†Kapton Tape is applied in Plasma chambers to reduce plasma damage, effectively enhancing polymer adaptation and saving maintenance efforts. Several types of Kapton tape have been developed to protect Chamber Lids and Electrodes, as plasma easily attacks parts in the etcher chamber. These proprietary protections not only prolong the lifetime of critical parts, they also incrase production yield. Figures show the installation of Kapton tape onto P5000 metal etcher chamber lids resulted in extended lid life and reduced partial issues caused by polymer peeling.

AMAT Endura Clamp Ring –†All series of clamp rings for AMAT Endura PVD systems are manufactured. Maerials include Titanium, Stainless, and Aluminum with sand blasting surface treatment. There are also several modified types of clamp rings to decrease edge cover rate and thus increase the dice numbers and reduce wafer sticking problems.

TEL Oxide Etcher Parts –†All series of TEL Oxide Etcher 5" and 8" process kits are manufactured; e.g. Electrodes, Liners, Baffle Plates and Focus Rings. Materials include: Aluminum anodized, Silicon, Amorphoous Carbon, Quarts and Vespel. Refurbihsing services are available for anodized parts like the liner, cover bellows, baffle plate, etc. All available to reduce the cost of ownership to the customer. Also available is the Upper Electrode for 85DD with vespel insert and the Shield Depo and Baffle Plate for the 85DD.

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